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ITHACA, N.Y. – Cornell University researchers who build nanoscale electronics have developed microsensors so tiny, they can fit 30,000 on one side of a penny. They are equipped with an integrated circuit, solar cells and light-emitting diodes (LEDs) that enable them to harness light for power and communication. And because they are mass fabricated, with […]

Photograph of the silicon nitride photonic chips used for frequency comb and photonic microwave generation. [Image: Junqiu Liu and Jijun He, EPFL] Microwave photonics—miniaturized wideband circuitry using carrier waves in between the radio and optical bands—will play a role in emerging 5G communications networks and the Internet of Things. Frequency combs serve as the bridge

Electrically pumped surface plasmon-polariton nanolaser. Credit: Dmitry Fedyanin Researchers from the Moscow Institute of Physics and Technology and King’s College London cleared the obstacle that had prevented the creation of electrically driven nanolasers for integrated circuits. The approach, reported in a recent paper in Nanophotonics, enables coherent light source design on the scale not only

LOS ANGELES–(BUSINESS WIRE)–The IMS2020 and Microwave Week transitioned to a virtual event, officially taking place from August 4 – 6, 2020. The event will continue with the theme of ‘Connectivity Matters’—built on five pillars that link the world: 5G & 6G networks, aerospace and defense programs, autonomous vehicles, the digital economy, and ensuring the connection

Researchers have developed some of the tiniest microsensors to date. Barely visible to the human eye, they can be used for next-generation electronic devices and microprocessors. A team at Cornell University has developed the nanoscale sensors, which include an integrated circuit, solar cell, and light-emitting diodes (LEDs) all in a device of which 30,000 can

CARLSBAD, Calif.–(BUSINESS WIRE)–MaxLinear, Inc. (NYSE: MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, announced today that it will attend the following financial conferences. Financial Conference Schedule Roth Virtual London Conference on Wednesday, June 24. Goldman Sachs Fifth

High levels of radiation, such as those occurring naturally in space and at high altitudes on Earth, can wreak havoc on electronics. MIT’s Lincoln Laboratory has developed a unique process for making integrated circuits resistant to damage and malfunction caused by extreme radiation levels. This fabrication capability — the 90-nanometer fully depleted silicon-on-insulator (FDSOI) complementary

NEW YORK, July 2, 2020 /PRNewswire/ — The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data. 3D ICs (Integrated Circuits) provide technical and economic enhancements in efficiency, architecture design, form factor, power, cost, time-to-market, and risk, and thereby drives the market demand. 3D

Abstract With optical spectral marks equally spaced by a frequency in the microwave or the radio frequency domain, optical frequency combs have been used not only to synthesize optical frequencies from microwave references but also to generate ultralow-noise microwaves via optical frequency division. Here, we combine two compact frequency combs, namely, a soliton microcomb and

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFICs, MMICs, and