RFIC

These San Diego companies know how to push data through so your 5G works fast

As 5G wireless technology continues to gain a foothold in the U.S. and worldwide, a top selling point for consumers is the uber-fast download speeds to smartphones that eventually could rival those of landline cable or fiber optic networks. Achieving those speeds, however, requires handling myriad airwave frequencies and radio channels to deliver better data […]

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Photonic microwave generation using on-chip optical frequency combs — ScienceDaily

In our information society, the synthesis, distribution, and processing of radio and microwave signals are ubiquitous in wireless networks, telecommunications, and radars. The current tendency is to use carriers in higher frequency bands, especially with looming bandwidth bottlenecks due to demands for e.g. 5G and the “Internet of Things.” “Microwave photonics,” a combination of microwave

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Tiny sensors fit 30,000 to a penny, transmit data from living tissue

ITHACA, N.Y. – Cornell University researchers who build nanoscale electronics have developed microsensors so tiny, they can fit 30,000 on one side of a penny. They are equipped with an integrated circuit, solar cells and light-emitting diodes (LEDs) that enable them to harness light for power and communication. And because they are mass fabricated, with

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On-Chip Frequency Combs for Microwave Generation

Photograph of the silicon nitride photonic chips used for frequency comb and photonic microwave generation. [Image: Junqiu Liu and Jijun He, EPFL] Microwave photonics—miniaturized wideband circuitry using carrier waves in between the radio and optical bands—will play a role in emerging 5G communications networks and the Internet of Things. Frequency combs serve as the bridge

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Breakthrough in the Creation of Electrically Driven Nanolasers for Integrated Circuits

Electrically pumped surface plasmon-polariton nanolaser. Credit: Dmitry Fedyanin Researchers from the Moscow Institute of Physics and Technology and King’s College London cleared the obstacle that had prevented the creation of electrically driven nanolasers for integrated circuits. The approach, reported in a recent paper in Nanophotonics, enables coherent light source design on the scale not only

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Microwave + RF Leaders to Present Virtually at IEEE MTT-S International Microwave Symposium (IMS2020)

LOS ANGELES–(BUSINESS WIRE)–The IMS2020 and Microwave Week transitioned to a virtual event, officially taking place from August 4 – 6, 2020. The event will continue with the theme of ‘Connectivity Matters’—built on five pillars that link the world: 5G & 6G networks, aerospace and defense programs, autonomous vehicles, the digital economy, and ensuring the connection

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Tiny Smartphones Eyed for Next-Gen Microprocessors

Researchers have developed some of the tiniest microsensors to date. Barely visible to the human eye, they can be used for next-generation electronic devices and microprocessors. A team at Cornell University has developed the nanoscale sensors, which include an integrated circuit, solar cell, and light-emitting diodes (LEDs) all in a device of which 30,000 can

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MaxLinear, Inc. to Present at Upcoming Financial Conferences

CARLSBAD, Calif.–(BUSINESS WIRE)–MaxLinear, Inc. (NYSE: MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, announced today that it will attend the following financial conferences. Financial Conference Schedule Roth Virtual London Conference on Wednesday, June 24. Goldman Sachs Fifth

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Lincoln Lab transfers integrated circuit process to industry | MIT News

High levels of radiation, such as those occurring naturally in space and at high altitudes on Earth, can wreak havoc on electronics. MIT’s Lincoln Laboratory has developed a unique process for making integrated circuits resistant to damage and malfunction caused by extreme radiation levels. This fabrication capability — the 90-nanometer fully depleted silicon-on-insulator (FDSOI) complementary

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3D IC Market to Reach USD 22.30 Billion by 2027 | CAGR of 16.6%

NEW YORK, July 2, 2020 /PRNewswire/ — The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data. 3D ICs (Integrated Circuits) provide technical and economic enhancements in efficiency, architecture design, form factor, power, cost, time-to-market, and risk, and thereby drives the market demand. 3D

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