As Moore’s Law Ends, Samsung Releases 3D IC Technology
Samsung made headlines last week when it announced the availability of its newest 3D IC technology. The new technology, called X-Cube, was tested and proven in a 7nm test chip, which stacked SRAM on top of a logic chip. The result was a smaller footprint and shorter signal paths, meaning faster signal propagation and less power […]
As Moore’s Law Ends, Samsung Releases 3D IC Technology Read More »