RF Engineer

World Scientific launches new book on CMOS Technology for 5G Future

IMAGE: Cover for “CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems “. view more  Credit: World Scientific Launched at the Singapore University of Technology and Design (SUTD) on 24 July 2019, CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems is World Scientific’s latest publication for 5G technology, co-authored by Prof Kiat-Seng Yeo […]

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Keysight Technologies, Integrated Device Technologies Collaborate on Component Characterization of 5G mmWave Beamforming Integrated Circuits

SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced an extended collaboration with Integrated Device Technologies, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), on component characterization of 5G new radio (NR)

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pSemi’s former CEO Jim Cable retires as chairman & chief technology officer

News: Microelectronics 3 January 2020 pSemi Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – says that, after more than 20 years with the firm, Jim Cable is retiring from his position as chairman & chief technology officer of pSemi and as global semiconductor

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What the FAQ are ASICs, ASSPs, SoCs, SOMs, etc.? – EEJournal

In my previous column — What the FAQ are CPUs, MPUs, MCUs, and GPUs? — we discussed the fact that the electronics industry is replete with acronyms, especially the three-letter variety. We also noted that we tend to learn a lot of things by osmosis, gradually (often unconsciously) assimilating nuggets of knowledge into a conceptual

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DARPA Selects BAE Systems to Build Powerful Next-Generation Advanced Electronics

NASHUA, N.H.–(BUSINESS WIRE)–BAE Systems was awarded a contract from the Defense Advanced Research Projects Agency (DARPA) to develop the next generation of mixed-signal electronics that could enable new Department of Defense (DoD) applications including high capacity, robust communications, radars, and precision sensors, and lead to solutions that enhance situational awareness and survivability for the warfighter.

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BAE Systems wins DARPA contract to develop mixed-signal electronics

The Defense Advanced Research Projects Agency (DARPA) has awarded a contract to BAE Systems to build the next generation of mixed-signal electronics. Under the $8m contract, BAE Systems FAST Labs research and development team will design and develop wafer-scale technology on a silicon foundry platform in collaboration with programme foundries. The technology could enable new

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DARPA selects performers to develop integrated mixed-mode RF electronics

DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. Today’s defence electronics

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Common Analog, Digital, and Mixed-Signal Integrated Circuits (ICs)

In the previous tutorial, we discussed the difference between analog and digital ICs, and now we’re ready to look at specific types of integrated circuits that play an important role in many electronic systems. However, you probably noticed that we have introduced a third category: in addition to analog and digital ICs, we have mixed-signal

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‘Connectivity Matters’ at IMS2020 in Los Angeles

LOS ANGELES–(BUSINESS WIRE)–The world’s leading microwave and RF researchers, designers, developers, and academics will head to Los Angeles for the IEEE MTT-S 2020 International Microwave Symposium (IMS2020) from June 21 – 26. IMS2020 is the flagship conference of Microwave Week, the world’s largest event for RF and Microwave technology. The six-day event, taking place at

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MaxLinear’s 2nd Generation PAM4 DSP Selected by Optoway Technology to Deliver Sub-3.5W 100G Optical Modules for Hyperscale Data Centers

CARLSBAD, Calif.–(BUSINESS WIRE)–Mar 11, 2020– MaxLinear, Inc. (NYSE: MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, today announced that Optoway Technology Inc., a key provider of fiber-optic networking products with over 19 years of experience designing optical

MaxLinear’s 2nd Generation PAM4 DSP Selected by Optoway Technology to Deliver Sub-3.5W 100G Optical Modules for Hyperscale Data Centers Read More »

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