Market Research Future published a research report on “Semiconductor Inspection System Market Research Report – Forecast to 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.
Market Scenario:
The global semiconductor inspection system market is expected to acquire substantial revenues and cross a valuation of USD 6.91 billion by 2023 where it can hope for a rise by 14.3% CAGR during the forecast period of 2018 to 2023. Market Research Future (MRFR), in its attempts to get substantial knowledge about the market, discussed factors that can provide thrust. Among them, the rising use of consumer electronics and healthcare equipment, hike in investment for the healthcare sector, research and development, surging disposable income that backs the demand for consumer electronics, and growing participation from emerging economies are major influencers.
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Key Players
Rudolph Technologies, Inc., JEOL Ltd., Nanometrics, Inc., KLA-Tencor Corporation, Applied Materials, Inc., Nikon Metrology NV, Lasertec Corporation, Hitachi High-Technologies Corp., Thermo Fisher Scientific, Inc., and ASML Holding NV are noteworthy players in the Semiconductor Inspection System Market. Players in the market are focusing on reducing the size of integrated circuits while possessing double the capacity and speed of previous generational semiconductor chips. Advent of IoT and urgent need for sensors in connected devices can present new growth opportunities for these players.
Segment Overview
The global market report containing details of the semiconductor inspection system market has been studied on the basis of type and end user. This study produces results that can be used for a better understanding of market prospects.
- By Type, the semiconductor inspection system market includes segments like wafer and mask inspection systems. The wafer inspection system segment is showing scopes of attaining a CAGR of 14.7% during the forecast period. These are gaining accolades for being instrumental in keeping all in sync for high process throughput and detecting particles in contact holes and on the surface.
- By End-User, the study of the semiconductor inspection system market includes large and small & medium enterprises (SMEs). The large enterprise segment used to dominate the global market in 2017.
Regional Analysis:
The North American market for semiconductor inspection system market would gain much from rising integration of internet of things or IoT. In Asia Pacific, the market is finding its easier to operate as developing countries have increased their investment for the sector.
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Industry News:
In September 2020, CyberOptics® Corporation, an eminent company making its name as a developer and manufacturer of high-precision 3D sensing technology solutions, are expected to launch, at the SEMICON Taiwan Global SiP Summit, their Fast, 100% 3D Wafer Bump Metrology and Inspection that would significantly transform yields and 3D system integration.
Advanced Packaging (AP) and wafer level packaging (WLP) are creating buzz in the evolving areas of semiconductor development and manufacturing. Such technologies are expected to benefit from CyberOptics’ contributions.
In August 2020, Israel’s Camtek, a company known for its ability to manufacture metrology and inspection equipment and catering the needs of diverse segments of the semiconductor industry, announced that the company has received orders for multiple systems from a tier-one radio frequency (RF) device manufacturer that can be valued at $7 million.
The customer has gone for Camtek’s advanced EagleT inspection system model. The remaining months of 2020 will witness the shipment and fixing of these tools. Camtek is anticipating additional orders that would be for the year 2021.
The global market report suggests that the market may remain unaffected due to the rising demand for cutting-edge products to support healthcare and consumer electronics segment. The initial setback due to the COVID-19 crisis is not going to persist for long as economies are taking measures to maintain normalcy.
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