RFIC

In my previous column — What the FAQ are CPUs, MPUs, MCUs, and GPUs? — we discussed the fact that the electronics industry is replete with acronyms, especially the three-letter variety. We also noted that we tend to learn a lot of things by osmosis, gradually (often unconsciously) assimilating nuggets of knowledge into a conceptual […]

NASHUA, N.H.–(BUSINESS WIRE)–BAE Systems was awarded a contract from the Defense Advanced Research Projects Agency (DARPA) to develop the next generation of mixed-signal electronics that could enable new Department of Defense (DoD) applications including high capacity, robust communications, radars, and precision sensors, and lead to solutions that enhance situational awareness and survivability for the warfighter.

The Defense Advanced Research Projects Agency (DARPA) has awarded a contract to BAE Systems to build the next generation of mixed-signal electronics. Under the $8m contract, BAE Systems FAST Labs research and development team will design and develop wafer-scale technology on a silicon foundry platform in collaboration with programme foundries. The technology could enable new

DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. Today’s defence electronics

In the previous tutorial, we discussed the difference between analog and digital ICs, and now we’re ready to look at specific types of integrated circuits that play an important role in many electronic systems. However, you probably noticed that we have introduced a third category: in addition to analog and digital ICs, we have mixed-signal

LOS ANGELES–(BUSINESS WIRE)–The world’s leading microwave and RF researchers, designers, developers, and academics will head to Los Angeles for the IEEE MTT-S 2020 International Microwave Symposium (IMS2020) from June 21 – 26. IMS2020 is the flagship conference of Microwave Week, the world’s largest event for RF and Microwave technology. The six-day event, taking place at

CARLSBAD, Calif.–(BUSINESS WIRE)–Mar 11, 2020– MaxLinear, Inc. (NYSE: MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, today announced that Optoway Technology Inc., a key provider of fiber-optic networking products with over 19 years of experience designing optical

Dublin, March 18, 2020 (GLOBE NEWSWIRE) — The “5G Chipset Market – Growth, Trends, and Forecast (2020 – 2025)” report has been added to ResearchAndMarkets.com’s offering. The global 5G chipset market was evaluated from 2019, as the technology has not yet been commercialized in 2018. The market is expected to grow at a CAGR of

LONDON, March 25, 2020 /PRNewswire/ — TheBusinessResearchCompany.com adds a latest report “Integrated Circuits Global Market Report 2020” to its research database. The report is spread across 150+ pages with a wide coverage on product types-  Digital IC; Analog IC; Mixed-Signal. Increasing Adoption Of Next-Generation Mobile Networks And IoT In The $412 Billion Integrated Circuits Market

Dublin, April 01, 2020 (GLOBE NEWSWIRE) — The “Integrated Circuits Global Market Report 2020” report has been added to ResearchAndMarkets.com’s offering. The global integrated circuits market was worth $412.3 billion in 2019. It is expected to grow at a compound annual growth rate (CAGR) of 5.09% and reach $502.94 billion by 2023. This report covers