| 1. |
EXECUTIVE SUMMARY |
| 1.1. |
5G, next generation cellular communications network |
| 1.2. |
Two types of 5G: Sub-6 GHz and mmWave 5G |
| 1.3. |
Overview of challenges, trends and innovations for mmWave 5G |
| 1.4. |
New opportunities for low-loss materials in mmWave 5G |
| 1.5. |
Where low-loss materials will be used: beam forming system in base station |
| 1.6. |
Where low-loss material will be used: substrate of mmWave antenna module for smartphone |
| 1.7. |
Where low-loss material will be used: multiple parts inside packages |
| 1.8. |
Low-loss materials can also be used in Radar |
| 1.9. |
Low-loss materials can also be used in radome cover or molding housing |
| 1.10. |
Overview of the low-loss materials covered by this report |
| 1.11. |
The role of thermoplastics polymers and thermosetting polymers |
| 1.12. |
Thermoset vs thermoplastics for 5G |
| 1.13. |
Organic substrate materials evolution for 5G |
| 1.14. |
Benchmark of commercialised low-loss organic laminates: Dk @ 10 GHz |
| 1.15. |
Benchmark of commercialised low-loss organic laminates: Df @ 10 GHz |
| 1.16. |
Strategies to achieve lower dielectric loss and trade-offs |
| 1.17. |
Where is the limit of the Dk for modified thermoset |
| 1.18. |
Main applications of Ceramic / LTCC in 5G |
| 1.19. |
Filter technologies that can work at mmWave 5G and which one will be the future |
| 1.20. |
LTCC and ceramic substrate will continue to play a key role in for RF filters |
| 1.21. |
Comparison of organic laminates, ceramic and glass substrates |
| 1.22. |
2G to mmWave 5G: from body or case integrated to flex PCB integrated to antenna in package |
| 1.23. |
EMC innovations trends for 5G applications |
| 1.24. |
Challenges and key trends for EMI shielding for 5G devices |
| 1.25. |
Low-loss materials forecast in 5G by revenue |
| 1.26. |
Low-loss materials areas forecast in 5G by frequency |
| 1.27. |
Low-loss materials areas forecast in 5G by market segments |
| 1.28. |
Low-loss materials areas forecast in 5G by types of materials |
| 1.29. |
Low-loss materials areas forecast in 5G base station by materials types |
| 1.30. |
Low-loss materials areas forecast in 5G smartphones by material types |
| 1.31. |
Low-loss materials areas forecast in 5G CPE and hotspots by material types |
| 2. |
INTRODUCTION |
| 2.1. |
5G technology and the role of low-loss materials |
| 2.1.1. |
5G, next generation cellular communications network |
| 2.1.2. |
What can 5G offer: high speed, massive connection and low latency |
| 2.1.3. |
Two types of 5G: Sub-6 GHz and mmWave |
| 2.1.4. |
5G is live globally |
| 2.1.5. |
5G market forecast for services 2018-2030 |
| 2.1.6. |
Global trends and new opportunities in 5G |
| 2.1.7. |
5G new radio technologies |
| 2.1.8. |
5G core network technologies |
| 2.1.9. |
5G infrastructure evolution |
| 2.1.10. |
5G station instalment forecast (2020-2030) by type of cell (macro, micro, pico/femto) |
| 2.1.11. |
Structure of massive MIMO system |
| 2.1.12. |
Challenges for radio frequency front end module (RF FEM) in mmWave 5G |
| 2.1.13. |
Global market share and historic shipment of base station antennas and active antennas |
| 2.1.14. |
5G user equipment landscape |
| 2.1.15. |
5G mobile shipment units 2018-2030 |
| 2.1.16. |
Shipment of customer promised equipment and hotspots by units 2018-2030 |
| 2.1.17. |
Overview of challenges, trends and innovations for mmWave 5G |
| 2.1.18. |
New opportunities for low-loss materials in mmWave 5G |
| 2.1.19. |
Overview of the low-loss materials covered by this report |
| 2.1.20. |
Where low-loss material will be used: beam forming system in base station |
| 2.1.21. |
sub-6 GHz and mmWave 5G antennas systems for base station in one unit |
| 2.1.22. |
Murata mmWave antenna module for base station |
| 2.1.23. |
Where low-loss material will be used: substrate of mmWave antenna module for smartphone |
| 2.1.24. |
Thermoplastic material for LDS smartphone antennas |
| 2.1.25. |
Suppliers for LDS materials |
| 2.1.26. |
Examples of 5G mmWave antenna for smartphone: Samsung |
| 2.1.27. |
Examples of 5G mmWave antenna for smartphone: Qualcomm |
| 2.1.28. |
mmWave 5G RF push up the RFFE cost for smartphones by 300% |
| 2.1.29. |
Where low-loss material will be used: multiple parts inside packages |
| 2.1.30. |
Roadmap of Df/Dk across all packaging materials as we transition from 4G to sub-6GHz 5G to mmwave 5G |
| 2.1.31. |
Example of mmWave power amplifiers with advanced packages |
| 2.2. |
Low-loss materials can also be used in radome cover or molding housing |
| 2.3. |
mmWave radar technology will also need low-loss materials |
| 2.3.1. |
Low-loss materials can also be used in Radar |
| 2.3.2. |
Different levels of autonomy |
| 2.3.3. |
Towards ADAS and Autonomous Driving: increasing sensor content |
| 2.3.4. |
Towards ADAS and Autonomous Driving: increasing radar use |
| 2.3.5. |
Different types of Radar: SRR, MRR and LRR |
| 2.3.6. |
The evolving role of the automotive radar towards full 360deg 4D imaging radar |
| 2.3.7. |
Automotive radars: role of legislation in driving the market |
| 2.3.8. |
Why are radars essential to ADAS and autonomy? |
| 2.3.9. |
Performance levels of existing automotive radars |
| 2.3.10. |
Radar players and market share |
| 2.3.11. |
Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (unit numbers) |
| 2.3.12. |
Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) |
| 2.3.13. |
Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) – moderate |
| 2.3.14. |
Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) – aggressive |
| 3. |
LOW-LOSS SUBSTRATE MATERIALS |
| 3.1. |
Introduction |
| 3.1.1. |
Overview of low-loss substrate materials |
| 3.1.2. |
Five important metrics for substrate materials will impact materials selection |
| 3.2. |
Low-loss organic laminate overview |
| 3.2.1. |
Electric properties of common polymer resin |
| 3.2.2. |
The role of thermoplastics polymers and thermosetting polymers |
| 3.2.3. |
Thermoset vs thermoplastics for 5G |
| 3.2.4. |
Organic substrate materials evolution for 5G |
| 3.2.5. |
Innovation trends for organic high frequency laminate materials |
| 3.2.6. |
Hybrid system to reduce the cost for high frequency board |
| 3.2.7. |
Key suppliers for high frequency and high-speed Copper Clad Laminate |
| 3.2.8. |
Benchmark of commercialised low-loss organic laminates |
| 3.2.9. |
Benchmark of commercialised low-loss organic laminates: Dk @ 10 GHz |
| 3.2.10. |
Benchmark of commercialised low-loss organic laminates: Df @ 10 GHz |
| 3.2.11. |
Other examples of low-loss laminate |
| 3.3. |
Low-loss thermoset resins |
| 3.3.1. |
Strategies to achieve lower dielectric loss and the trade-off |
| 3.3.2. |
Polarizability and molar volume are the main factor for the dielectric loss |
| 3.3.3. |
Use low polar functional groups or atomic bonds to reduce the Dk |
| 3.3.4. |
Introducing bulky structures can reduce the Dk |
| 3.3.5. |
Porous structure exhibits lower Dk |
| 3.3.6. |
Rigid structure will lead to lower Df |
| 3.3.7. |
Feature sizes will influence in the dielectric constant |
| 3.3.8. |
Thinness will influence in the dielectric constant |
| 3.3.9. |
Thinning the substrate at high frequencies: the challenge |
| 3.3.10. |
Curing temperature influences the Df and Dk of polymers |
| 3.3.11. |
Introducing an additive component might be necessary to optimise the performance |
| 3.3.12. |
Strategy from Toray to reduce the Dk and Df for PI materials |
| 3.3.13. |
Strategy from Taiyo Ink to reduce the Dk and Df for Epoxy materials |
| 3.3.14. |
Strategy from Mitsubishi Gas Chemical to reduce the Dk and Df for BT resin laminate |
| 3.3.15. |
Strategy from DuPont to reduce Dk and Df for Arylalkyl thermoset polymers |
| 3.3.16. |
Strategy from JSR Corp to reduce Dk and Df for aromatic polyether polymer (HC polymer) |
| 3.3.17. |
Strategy from Hitachi Chemical to reduce Dk and Df for polycyclic resin based substrate |
| 3.3.18. |
Strategy from Taiyo Ink to reduce Dk and Df for Epoxy based build up materials |
| 3.3.19. |
Strategy from Taiyo Ink to reduce Dk and Df for Epoxy based high-density RDL |
| 3.3.20. |
Where is the limit of the Dk for modified thermoset |
| 3.3.21. |
Isola |
| 3.3.22. |
Isola: product for mmWave 5G |
| 3.3.23. |
Low-loss thermoset laminates in Isola |
| 3.4. |
Thermoplastic polymer: Liquid crystal polymer |
| 3.4.1. |
LCP |
| 3.4.2. |
Advantages and limitations of LCP |
| 3.4.3. |
Classification of LCP |
| 3.4.4. |
Smartphones use LCP antennas and FPCBs |
| 3.4.5. |
LCP supply chain |
| 3.4.6. |
Three type of LCP resins and the key players |
| 3.4.7. |
Market share of LCP resin globally in 2019 |
| 3.4.8. |
LCP as an alternative to PI for flexible printed circuit board |
| 3.4.9. |
LCP vs PI: Dk and Df |
| 3.4.10. |
LCP vs PI: moisture |
| 3.4.11. |
LCP vs PI: flexibility |
| 3.4.12. |
LCP vs MPI: cost |
| 3.4.13. |
LCP vs MPI: FCCL signal loss |
| 3.4.14. |
LCP resin and LCP-FCCL |
| 3.4.15. |
Battle of next generation antennas for smartphone |
| 3.4.16. |
2G to mmwave 5G: from body or case integrated to flex PCB integrated to antenna in package |
| 3.4.17. |
Murata: LCP antennas for smartphone |
| 3.4.18. |
Performance of MetroCirc |
| 3.4.19. |
Career Technology: key supplier for LCP materials |
| 3.4.20. |
Avary/ZDT |
| 3.4.21. |
KGK Kyodo Giken Kagaku |
| 3.4.22. |
LCP FCCL in SYTECH for mmWave 5G |
| 3.4.23. |
IQLP |
| 3.4.24. |
LCP products from IQCP |
| 3.4.25. |
LCP PCB board developed by IQLP and DuPont |
| 3.5. |
Thermoplastic polymer: PTFE |
| 3.5.1. |
Fluoropolymer and PTFE |
| 3.5.2. |
Key properties of PTFE to be considered for 5G applications |
| 3.5.3. |
Dielectric properties for PTFE |
| 3.5.4. |
The Dk for PTFE based laminate depends on the crystallinity density |
| 3.5.5. |
Key application of PTFE in 5G |
| 3.5.6. |
Hybrid couplers using PTFE as substrate |
| 3.5.7. |
Ceramic filled vs. glass-filled PTFE laminates |
| 3.5.8. |
Concerns of using PTFE based laminate for high frequency 5G |
| 3.5.9. |
Global manufacturing of PTFE resin |
| 3.5.10. |
Rogers is the top supplier for PTFE laminates |
| 3.5.11. |
Ceramic filled PTFE laminates in Rogers |
| 3.6. |
Other organic materials |
| 3.6.1. |
Sabic: PPO |
| 3.6.2. |
Panasonic: MEGTRON |
| 3.6.3. |
Solvay: PPS for base station antenna |
| 3.6.4. |
Hydrocarbon based laminates |
| 3.6.5. |
Polymer aerogels as antennas substrate |
| 3.6.6. |
Blueshift: AeroZero for polyimide aerogel laminates |
| 3.6.7. |
Other substrates: wood-derived cellulose nanofibril |
| 3.7. |
Covestro: polycarbonates for injection molded enclosures and covers |
| 3.8. |
Covestro: polycarbonates for thermal management |
| 3.9. |
Inorganic substrate materials |
| 3.9.1. |
Ceramic / LTCC |
| 3.9.2. |
Where Ceramic / LTCC will be used in 5G |
| 3.9.3. |
Ceramic substrates |
| 3.9.4. |
From HTCC to LTCC |
| 3.9.5. |
LTCC and HTCC packages substrate |
| 3.9.6. |
HTCC metal-ceramic packages substrate |
| 3.9.7. |
LTCC packages substrate for RF transitions |
| 3.9.8. |
Benchmark of various LTCC materials |
| 3.9.9. |
Dielectric constant: stability vs frequency for different inorganic substrates (LTCC, glass) |
| 3.9.10. |
Temperature stability of dielectric parameters of HTCC and LTCC alumina |
| 3.9.11. |
Filters are made commonly in LTCC substrate, but other technologies are in need |
| 3.9.12. |
Filter technologies that can work at mmWave 5G and which one will be the future |
| 3.9.13. |
Benchmark of various filter technologies for mmWave 5G applications |
| 3.9.14. |
LTCC and ceramic substrate will continue to play a key role in for RF filters |
| 3.9.15. |
Multilayer LTCC: production challenge |
| 3.9.16. |
Ceramic materials can be used as thermal interface materials |
| 3.9.17. |
NGK: multi-layer LTTC-based filters |
| 3.9.18. |
Kyocera: LTCC substrate for package |
| 3.9.19. |
Kyocera: LTCC vs. organic packages |
| 3.9.20. |
Kyocera: R&D focus for LTCC packages |
| 3.9.21. |
Kyocera LTCC for mmWave AiP (28GHz and 60 GHz) |
| 3.9.22. |
Kyocera: multi-layer 28GHz LTCC filter |
| 3.9.23. |
Kyocera mmWave embedded filter under development |
| 3.9.24. |
Sunway communication: LTCC based phased array antenna for mmWave 5G mobile |
| 3.9.25. |
Tecdia: thin film substrate and ceramic capacitors |
| 3.9.26. |
Minicircuits: multilayer LTCC filter |
| 3.9.27. |
TDK: LTCC AiP for 5G |
| 3.10. |
Ferro: LTCC with wide range of Dk |
| 3.10.1. |
Glass |
| 3.10.2. |
Benchmark of various glass substrates |
| 3.10.3. |
Use the HF-F for low transmission loss laminate |
| 3.10.4. |
Glass integrated passive devices (IPD) filter for 5G by advanced semiconductor engineering |
| 3.10.5. |
Glass substrate from Hitachi Chemical |
| 3.10.6. |
Glass: an excellent filter substrate? |
| 3.10.7. |
Glass-based single-layer transmission-line filters |
| 3.11. |
Summary |
| 3.11.1. |
Substrate properties and process options |
| 3.11.2. |
Benchmark of different substrates |
| 3.11.3. |
Substrates options for mmWave filters |
| 4. |
LOW-LOSS MATERIALS FOR ADVANCED PACKAGE |
| 4.1. |
Introduction |
| 4.1.1. |
Roadmap of Df/Dk across all packaging materials as we transition from 4G to sub-6GHz 5G to mmwave 5G |
| 4.1.2. |
Overview of high density package materials |
| 4.1.3. |
Low-loss polymer materials for coating in packages |
| 4.1.4. |
Possible low-loss substrates for mmWave 5G advanced packages |
| 4.1.5. |
Flexible substrate has became a trend |
| 4.1.6. |
Low-loss substrate materials as for package |
| 4.2. |
Overview of advanced packaging |
| 4.2.1. |
Top players in the electronic packaging business by revenue |
| 4.2.2. |
Electronic packaging: the rise of China |
| 4.2.3. |
IC sales and global GDP |
| 4.2.4. |
Split of advanced electronic packaging market by packaging type |
| 4.2.5. |
From simple to complex electronic packages: technology evolution |
| 4.3. |
SiP (system-in-package) introduction |
| 4.3.1. |
What is SiP or System-in-Package |
| 4.3.2. |
SiP vs SoC vs SoB |
| 4.3.3. |
SiP and different packaging techniques |
| 4.3.4. |
The SiP Tool box |
| 4.3.5. |
A rising trend towards more SiP content |
| 4.4. |
General trends in size and feature of boards and packages |
| 4.4.1. |
Classification of packages by power level |
| 4.4.2. |
Resolution and layer thickness going from wafer to RDL to substrate to board |
| 4.4.3. |
Increasing resolution and complexity and reducing thickness of PCBs/SLP |
| 4.4.4. |
Trends in laser technology and pattern formation techniques for HDI PCB, SLP, and package |
| 4.5. |
Towards AiP (antenna in a package) |
| 4.5.1. |
2G to mmwave 5G: from body or case integrated to flex PCB integrated to antenna in package |
| 4.5.2. |
Is antenna on a chip possible? |
| 4.5.3. |
Antenna on a package (AoP) with metal stamping |
| 4.5.4. |
Antenna on a package (AoP) with laser direct structuring |
| 4.5.5. |
Qualcomm: Antenna in package design (antenna on a substrate with flip chipped ICs) |
| 4.5.6. |
Georgia Tech: SiP with antenna on a glass-core substrate |
| 4.5.7. |
Intel: SiP with dual-polarized patch array antenna |
| 4.5.8. |
JCET: PoP or antenna substrate on WLP approach |
| 4.5.9. |
ASE: SiP with AiP based on FOWLP and using through-mold via |
| 4.5.10. |
AiP FCBGA vs AiP FOWLP |
| 4.5.11. |
eWLP vs flip chip and BGA in terms of insertion loss |
| 4.5.12. |
TSMC: InFO AiP showing low-loss for mmWave |
| 4.5.13. |
Amkor: a multitude of AiP approaches including WLP, SWIFT, PoP, etc |
| 4.5.14. |
Towards ever lower low tan and higher surface smoothness |
| 4.5.15. |
TDK: AiP based on LTCC |
| 4.5.16. |
Wideband low-profile antennas for 5G AiP application by IMECAS |
| 4.6. |
EMC/MUF |
| 4.6.1. |
What are EMC and MUFs? |
| 4.6.2. |
Epoxy Molding Compound (EMC) |
| 4.6.3. |
Key parameters to compare EMC materials |
| 4.6.4. |
Dielectric constant is another important factor for 5G applications |
| 4.6.5. |
Innovation for low dielectric constant and dissipation factor epoxy resin |
| 4.6.6. |
Some commercial EMC with low dielectric constant |
| 4.6.7. |
Epoxy resin: parameters of different resins and hardener systems |
| 4.6.8. |
Epoxy resin: price and market |
| 4.6.9. |
Fillers |
| 4.6.10. |
EMC is important for warpage management |
| 4.6.11. |
Molded underfill (MUF) |
| 4.6.12. |
MUF is a key material for flip clip molding technology |
| 4.6.13. |
Liquid molding compound for compression molding |
| 4.6.14. |
Supply chain for EMC materials |
| 4.6.15. |
EMC innovations trends for 5G applications |
| 4.6.16. |
High warpage control EMC are needed for FO-WLP |
| 4.6.17. |
Possible solutions for warpage and die shift |
| 4.6.18. |
Sumitomo Bakelite |
| 4.6.19. |
Kyocera: Epoxy Molding Compounds for semiconductors |
| 4.6.20. |
Summary of EMC provided by Kyocera |
| 4.6.21. |
Samsung SDI |
| 4.6.22. |
Hitachi Chemical |
| 4.6.23. |
Packaging materials product line up in Hitachi Chemical |
| 4.6.24. |
A sulfur-free EMC by Hitachi Chemical |
| 4.6.25. |
KCC |
| 4.7. |
Ink based EMI shielding |
| 4.7.1. |
What is electromagnetic interference shielding and why it matters to 5G |
| 4.7.2. |
Challenges and key trends for EMI shielding for 5G devices |
| 4.7.3. |
Package-level EMI shielding |
| 4.7.4. |
Conformal coating: increasingly popular |
| 4.7.5. |
Has package-level shielding been adopted? |
| 4.7.6. |
Examples of package-level shielding in smartphones |
| 4.7.7. |
Which suppliers and elements have used EMI shielding? |
| 4.7.8. |
Overview of conformal shielding process |
| 4.7.9. |
What is the incumbent process for PVD sputtering? |
| 4.7.10. |
Screen printed EMI shielding: process and merits |
| 4.7.11. |
Spray-on EMI shielding: process and merits |
| 4.7.12. |
Suppliers targeting ink-based conformal EMI shielding |
| 4.7.13. |
Henkel: performance of EMI ink |
| 4.7.14. |
Duksan: performance of EMI ink |
| 4.7.15. |
Ntrium: performance of EMI ink |
| 4.7.16. |
Clariant: performance of EMI ink |
| 4.7.17. |
Fujikura Kasei: performance of EMI ink |
| 4.7.18. |
Spray machines used in conformal EMI shielding |
| 4.7.19. |
Particle size and morphology choice |
| 4.7.20. |
Ink formulation challenges: thickness and Ag content |
| 4.7.21. |
Ink formulation challenges: sedimentation prevention |
| 4.7.22. |
EMI shielding: inkjet printed particle-free Ag inks |
| 4.7.23. |
Agfa: EMI shielding prototype |
| 4.7.24. |
Has there been commercial adoption of ink-based solutions? |
| 4.7.25. |
Compartmentalization of complex packages is a key trend |
| 4.7.26. |
The challenge of magnetic shielding at low frequencies |
| 4.7.27. |
Value proposition for magnetic shielding using printed inks |
| 5. |
FORECAST 2021-2030 |
| 5.1. |
Low-loss materials areas forecast in 5G by frequency |
| 5.2. |
Low-loss materials areas forecast in 5G by market segments |
| 5.3. |
Low-loss materials areas forecast in 5G by types of materials |
| 5.4. |
Low-loss materials forecast in 5G by revenue |
| 5.5. |
5G base station installation forecast by frequency |
| 5.6. |
5G base station instalment number forecast by type of cell (macro, micro, pico/femto) |
| 5.7. |
Low-loss materials areas forecast in 5G base station by frequency |
| 5.8. |
Low-loss materials areas forecast in 5G base station by components |
| 5.9. |
Low-loss materials areas forecast in 5G base station by materials types |
| 5.10. |
5G mobile shipment units |
| 5.11. |
Low-loss materials areas forecast in 5G smartphone by unit number and area |
| 5.12. |
Low-loss materials areas forecast in 5G smartphones by material types |
| 5.13. |
Shipment of customer promised equipment and hotspots by units |
| 5.14. |
Low-loss materials areas forecast in 5G CPE and hotspots by frequency |
| 5.15. |
Low-loss materials areas forecast in 5G CPE and hotspots by material types |
