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Semiconductor Packaging

“Semiconductor Packaging Market” report provides strategic supports mentioned by the business specialists with market sources, amount of manufacturing cost structure, raw materials, forecasts, turnover, manufacturing outlays, latest market trends, labor cost, demands and much more. Semiconductor Packaging market report covers a comprehensive market structure through the globe with an in-depth study of major dynamics (Drivers, Challenges, Opportunities).

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Key Market Trends:

High Adoption Rate in Consumer Electronics Segment to Augment the Market Growth

– The electronics market constantly demands higher power dissipation, faster speeds, and higher pin counts, along with smaller footprints and lower profiles. The miniaturization and integration of semiconductors have given rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices.
– Each new iteration of consumer electronics products is smarter, lighter, and more energy efficient than its predecessors. This advantage creates huge expectations among customers for the next iteration, which is a significant selling point for the producers of consumer electronics.
– In addition to this, smartphones are one of the most significant contributors to semiconductor consumption in the consumer electronics segment. In recent years, the has witnessed consistent growth in smartphone sales. With this trend likely to continue, it is poised to drive the semiconductor demand, in turn, augmenting the packaging market growth.

North America Expected to Hold a Significant Share

– Countries in the region, such as the lead the world in manufacturing, design, and research in the semiconductor industry. The is also the frontrunner in semiconductor packaging innovation, boasting of 80 wafer fabrication plants spread across 19 states. Apart from this, investments in the country by major players are set to fuel the semiconductor packaging market.
– For instance, Intel Corporation in 2017 had planned to invest more than USD 7 billion to complete Fab 42, a semiconductor factory, which is expected to be ready in 3-4 years.
– Apart from this, the is home to some of the major automotive players in the world, which are investing in the electric car segment. This is set to augment the demand for semiconductors in the automotive industry significantly. In turn, it is driving the semiconductor packaging market.
– For instance, Toyota in 2018 announced CAD 1.4 billion in two factories in central Canada where it plans to build its largest hybrid hub in North America. The government is expected to support the investment with CAD 110 million in Cambridge and Woodstock.

Market Overview:

The global semiconductor packaging market was valued at USD 26.12 billion in 2018 and is expected to be worth USD 41.16 billion by 2024, recording a CAGR of 7.96% over the forecast period (2019-2024). Owing to the growing demand across various end-user verticals of the packaging industry, the industry has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product. Since packaging is in the early stage in the electronics value chain, the growth of the market studied is directly impacted by the growth of the semiconductor market.

– The advent of IoT and artificial intelligence (AI) and the proliferation of sophisticated electronics are factors driving the high-end application segment across the consumer electronics and automotive industries that have increased the rate of adoption of the latest semiconductor packaging technologies, to meet the growing demand.

– Semiconductor packaging technology has evolved to minimize the costs involved and enhance the overall efficacy of ICs. Vendors in the market are under constant pressure to deliver innovative solutions in terms of the size of the packaging, performance, and the “time-to-market” aspect.

– Also, the emergence of 2.5D and 3D packaging mechanism, as of mid-2010, has made semiconductor manufacturers extend their flip-chip and wafer-level capabilities, owing to their enhanced functionality.

Key Manufacturers Like

ASE Group

Amkor Technology

Jcet/Stats Chippac Ltd.

Siliconware Precision Industries Co. Ltd. (Spil)

Powertech Technology, Inc.

Tianshui Huatian Technology Co. Ltd.

Fujitsu Ltd.

UTAC Group

Chipmos Technologies, Inc.

Chipbond Technology Corporation

Intel Corporation

Samsung Electronics Co. Ltd.

Unisem (M) Berhad

Interconnect Systems, Inc. (ISI)

Carsem.

Scope of the Report:

Semiconductor packaging is a casing containing one or more discrete semiconductor devices or integrated circuits made up metal, plastic, glass, or ceramic casing. Packaging must protect an electronic system from cooling, radio frequency noise emission, mechanical damage, and electrostatic discharge.

Semiconductor Packaging market report focuses on the latest trends in the global and regional spaces on all the significant components, including the capacity, cost, price, technology, supplies, production, profit, and competition. Moreover, the old data and present development of the Semiconductor Packaging market have been given in the scope of the report. The latest trends, product portfolio, demographics, geographical segmentation, and regulatory framework of the Semiconductor Packaging market have also been involved in the study.

Market Dynamics: –

Drivers: (Developing regions and growing markets)
Limitations: (Regional, Key Player facing Issues, Future Barriers for growth)
Opportunities: (Regional, Growth Rate, Competitive, Consumption)

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Key Questions Answered in Market Report: –

What will the market growth rate, Overview and Analysis by Type of Semiconductor Packaging market in 2023?
What are the key factors driving, Analysis by Applications and Countries Semiconductor Packaging market?
What are Dynamics, This Overview Includes Analysis of Scope, and price analysis of top Vendors Profiles of Semiconductor Packaging ?
Who are Opportunities, Risk and Driving Force of Semiconductor Packaging market? Knows Upstream Raw Materials Sourcing and Downstream Buyers
Who are the opportunities and threats faced by the vendors in Semiconductor Packaging space? Business Overview by Type, Applications, Gross Margin and Market Share
What are the Semiconductor Packaging market opportunities, market risk and market overview of the Market?

Lastly, the Global Semiconductor Packaging Market Research covers a complete market structure across the world with a comprehensive analysis of major key factors. This report provides planned orientations referred by the industry experts.

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Study objectives of Semiconductor Packaging Market Report:

To provide a detailed analysis of the market structure along with the Semiconductor Packaging market forecast of various segments and sub-segments of the Semiconductor Packaging market
To provide insights into factors influencing and affecting market growth
To provide historical, current, and forecast revenue of market segments based on material, type, design, and end user
To provide historical, current, and forecast revenue of market segments and sub-segments with respect to regional markets and key countries
To provide strategic profiling of key players in the market, comprehensively analyzing their market shares, core competencies, and drawing a competitive landscape for the market
To provide economic factors, technology and Semiconductor Packaging market trends that influence the global Semiconductor Packaging market

Detailed TOC of Semiconductor Packaging Market Report 2019-2024:

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Market Definition

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Growing Consumption of Semiconductor Devices Across Industries
4.3.2 Need for Miniaturization of Semiconductor Devices
4.4 Market Restraints
4.4.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs
4.5 Industry Attractiveness – Porter’s Five Force Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Value Chain Analysis

5 MARKET SEGMENTATION
5.1 By Packaging Platform
5.1.1 Flip Chip
5.1.2 Embedded Die
5.1.3 Fan-in Wafer Level Packaging (Fi Wlp)
5.1.4 Fan-out Wafer Level Packaging (Fo Wlp)
5.2 By End-user Industry
5.2.1 Consumer Electronics
5.2.2 Aerospace & Defense
5.2.3 Medical Devices
5.2.4 Communications & Telecom
5.2.5 Automotive Industry
5.2.6 Energy & Lighting
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 ASE Group
6.1.2 Amkor Technology
6.1.3 Jcet/Stats Chippac Ltd.
6.1.4 Siliconware Precision Industries Co. Ltd. (Spil)
6.1.5 Powertech Technology, Inc.
6.1.6 Tianshui Huatian Technology Co. Ltd.
6.1.7 Fujitsu Ltd.
6.1.8 UTAC Group
6.1.9 Chipmos Technologies, Inc.
6.1.10 Chipbond Technology Corporation
6.1.11 Intel Corporation
6.1.12 Samsung Electronics Co. Ltd.
6.1.13 Unisem (M) Berhad
6.1.14 Interconnect Systems, Inc. (ISI)
6.1.15 Carsem