RF News

GlobeNewswire Nano Dimension Prices $250 Million Registered Direct Offering Sunrise, Florida, Dec. 27, 2020 (GLOBE NEWSWIRE) — Nano Dimension Ltd. (Nasdaq: NNDM), a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, today announced it has entered into definitive agreements with investors for the sale of 33,333,334 of the Company’s American Depositary Shares (“ADSs”) at a price […]

Samsung’s new RFIC for 5G base stations. (Image: Samsung) Samsung has launched new RFICs and DAFE ASICs that go into 5G chipset, the company announced. The chips will reduce a 5G base station’s size, weight, and power consumption by 25 percent compared to previous iterations, the company said, increasing efficiency and the ability for rollout.

IMAGE: Cover for “CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems “. view more  Credit: World Scientific Launched at the Singapore University of Technology and Design (SUTD) on 24 July 2019, CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems is World Scientific’s latest publication for 5G technology, co-authored by Prof Kiat-Seng Yeo

SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced an extended collaboration with Integrated Device Technologies, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), on component characterization of 5G new radio (NR)

News: Microelectronics 3 January 2020 pSemi Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – says that, after more than 20 years with the firm, Jim Cable is retiring from his position as chairman & chief technology officer of pSemi and as global semiconductor

In my previous column — What the FAQ are CPUs, MPUs, MCUs, and GPUs? — we discussed the fact that the electronics industry is replete with acronyms, especially the three-letter variety. We also noted that we tend to learn a lot of things by osmosis, gradually (often unconsciously) assimilating nuggets of knowledge into a conceptual

NASHUA, N.H.–(BUSINESS WIRE)–BAE Systems was awarded a contract from the Defense Advanced Research Projects Agency (DARPA) to develop the next generation of mixed-signal electronics that could enable new Department of Defense (DoD) applications including high capacity, robust communications, radars, and precision sensors, and lead to solutions that enhance situational awareness and survivability for the warfighter.

The Defense Advanced Research Projects Agency (DARPA) has awarded a contract to BAE Systems to build the next generation of mixed-signal electronics. Under the $8m contract, BAE Systems FAST Labs research and development team will design and develop wafer-scale technology on a silicon foundry platform in collaboration with programme foundries. The technology could enable new

DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. DARPA has confirmed the selection of nine research teams to develop advanced RF mixed-mode electronics critical to emerging defence applications in communications, radar, and electronic warfare. Today’s defence electronics

In the previous tutorial, we discussed the difference between analog and digital ICs, and now we’re ready to look at specific types of integrated circuits that play an important role in many electronic systems. However, you probably noticed that we have introduced a third category: in addition to analog and digital ICs, we have mixed-signal