Lincoln Lab transfers integrated circuit process to industry
This fabrication capability, the 90-nanometer fully depleted silicon-on-insulator (FDSOI) complementary metal-oxide-semiconductor (CMOS) process, is now being transferred to microchip manufacturer SkyWater Technology, which will use it to produce radiation-hardened, or rad-hard, electronics. Lincoln Laboratory began working on fully depleted silicon-on-insulator technology in the mid-1990s under sponsorship of the U.S. Defence Advanced Research Projects Agency (DARPA). […]
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